产品领域:通信机站
层数:42L 板厚:5.0mm;介电常数4.20,介电质损耗
尺寸:1252*420mm/1PCS
工艺结构:高频混压、FR-4TG170+Rogers4008、小孔0.30mm、小线宽4/4mil,孔径比30:1、阻抗Ω±10% 表面处理:沉金 小孔铜:20um
Product field: communication station,Number of layers: 42L Plate thickness: 5.0mm; dielectric constant 4.20, dielectric loss,Size: 1252*420mm/1PCS,Process structure: high frequency mixed pressure, FR-4TG170+Rogers4008, minimum hole 0.30mm, minimum line width 4/4mil, aperture ratio 30:1, impedance Ω±10%,Surface treatment: immersion gold Minimum hole copper: 20um,Surface treatment: immersion gold Minimum hole copper: 20um